By King-ning Tu
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Additional resources for Solder joint technology
Fine, “Tin-silver-copper eutectic temperature and composition,” Metall. Mater. , 31A, 1155–1162 (2000). 10. -W. Moon, W. J. Boettinger, U. R. Kattner, F. S. Biancaniello, and C. A. Handwerker, “Experimental and thermodynamic assessment of SnAg-Cu solder alloys,” J. Electron. , 29, 1122–1136 (2000). 11. Z. N. Tu, “Immersion tin: its chemistry, metallurgy and application in electronic packaging technology,” IBM J. Res. Dev. 28, 726–734 (1984). 12. “1999 International Roadmap for Semiconductor Technology,” Semiconductor Industry Association, San Jose, CA (1999).
A) Map representing the angle between the direction of Cu6 Sn5 and the  direction of Cu, after 4 minutes of wetting reaction. Most of the spots have the angle close to 0◦ . 9(a). SVNY339-Tu April 5, 2007 17:44 Copper–Tin Reactions in Bulk Samples 45 Fig. 10. (a) Structure of Cu6 Sn5 projected along [−101] direction. Copper atoms in the Cu6 Sn5 are represented by circles. (b) Crystal planes for the six orientation relationships labeled with respect to the Cu atom hexagon shown above can be classiﬁed into two groups.
G. Kim, K. N. Tu, A. K. Mal, and D. R. Frear, “Interfacial morphology and shear deformation of ﬂip chip solder joints,” J. Mater. , 15, 1679–1687 (2000). 20. M. Date, T. Shoji, M. Fujiyoshi, K. Sato, and K. N. Tu, “Ductile-to-brittle transition in Sn-Zn solder joints measured by impact test,” Scr. Mater. 51, 641–645 (2004). 21. S. Brandenburg and S. Yeh, “Electromigration studies of ﬂip chip bump solder joints,” in Proc. Surface Mount International Conference and Exposition, SMTA, Edina, MN, 1998, p.